1.PCB, do not indicate the material preparation, highlighted here is, need to burn EEPROM program for ROM version, it is best to use a burner to EEPROM programming well, go patch.

2. After the patch is complete, due to the EEPROM before is the same, solid also need Bluetooth address is modified, modified to make finished products.

3. In General, modules, or under the headphones require sampling distance, by instrument under the sweeping power, and antenna parameters.

4. Function test, if is a modular fixture testing needs to be done, headsets direct testing capabilities, Bluetooth software in General is: BlueSoleil. Of course still needs testing, while the 3rd useful instrument test antenna, but actual distance there are minute differences.

Note: Burn EEPROM has a lot of batches burn EEPROM tool on the market, has to buy, burn well and then go to the patch, because of all the online FLASH version to burn, SPI for mass production after the burn, including practical USB SPI burn speed is about 3 times faster than the LPT SPI. However, much more expensive USB SPI prices will.